Modern Electro-Plating
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Modern Electroplating, 5th Edition
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Open to the public ; TS Sometimes the pulse electroplating can be performed in heated electroplating bath to increase the depositing rate since the rate of almost all the chemical reaction increases exponentially with temperature per Arrhenius law. Schlesinger is coauthor, with Milan Paunovic, of the first and second editions of Fundamentals of Electrochemical Deposition and the previous edition of Modern Electroplating both by Wiley. Pulse electroplating could help to improve the quality of electroplated film and release the internal stress built up during fast deposition. If it is desirable to plate one type of deposit onto a metal to improve corrosion resistance but this metal has inherently poor adhesion to the substrate, a strike can be first deposited that is compatible with both.
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State Library of South Australia. The University of Melbourne. Thisexpanded new edition addresses these developments, Mordechay Schlesinger , Milan Paunovic. The definitive resource for electroplating, now completely up todate With advances in information-age technologies, the field ofelectroplating has seen dramatic growth in the decade since theprevious edition of Modern Electroplating was published.
Easily accessible, self-contained contributions by over thirtyexperts Five completely new chapters and hundreds of additionalpages A cutting-edge look at applications in nanoelectronics Coverage of the formation of nanoclusters and quantum dots usingscanning tunneling microscopy STM An important discussion of the physical properties of metal thinfilms Chapters devoted to methods, tools, control, and environmentalissues And much more A must-have for anyone in electroplating, including technicians,platers, plating researchers, and metal finishers, ModernElectroplating, Fifth Edition is also an excellent reference forelectrical engineers and researchers in the automotive, datastorage, and medical industries.
Electroless and Electrodeposition of Silver. Electrodeposition of Lead and Lead Alloys. Electroless Deposition of Copper. Electroless Deposition of Nickel. A simple modification in electroplating is pulse electroplating. This process involves the swift alternating of the potential or current between two different values resulting in a series of pulses of equal amplitude, duration and polarity, separated by zero current.
By changing the pulse amplitude and width, it is possible to change the deposited film's composition and thickness. Duty cycle is the effective portion of time in certain electroplating period with the current or potential applied. Pulse electroplating could help to improve the quality of electroplated film and release the internal stress built up during fast deposition.
Combination of the short duty cycle and high frequency could decrease the surface cracks.
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Another common problem of pulse electroplating is that the anode material could get plated and contaminated during the reverse electroplating, especially for the high cost, inert electrode like platinum. Other factors that could affect the pulse electroplating include temperature, anode-to-cathode gap and stirring.
A must-have for anyone in electroplating, including technicians, platers, plating researchers, and metal finishers, Modern Electroplating, Fifth Edition is also an. View Table of Contents for Modern Electroplating seen dramatic growth in the decade since the previous edition of Modern Electroplating .
Sometimes the pulse electroplating can be performed in heated electroplating bath to increase the depositing rate since the rate of almost all the chemical reaction increases exponentially with temperature per Arrhenius law. The anode-to-cathode gap is related to the current distribution between anode and cathode. Small gap to sample area ratio may cause uneven distribution of current and affect the surface topology of plated sample. Stirring setting varies for different metal electroplating processes. A closely related process is brush electroplating, in which localized areas or entire items are plated using a brush saturated with plating solution.
The brush, typically a stainless steel body wrapped with an absorbent cloth material that both holds the plating solution and prevents direct contact with the item being plated, is connected to the anode of a low voltage direct current power source, and the item to be plated connected to the cathode.
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The operator dips the brush in plating solution then applies it to the item, moving the brush continually to get an even distribution of the plating material. Brush electroplating has several advantages over tank plating, including portability, ability to plate items that for some reason cannot be tank plated one application was the plating of portions of very large decorative support columns in a building restoration , low or no masking requirements, and comparatively low plating solution volume requirements.
Disadvantages compared to tank plating can include greater operator involvement tank plating can frequently be done with minimal attention , and inability to achieve as great a plate thickness. Usually an electrolytic cell consisting of two electrodes, electrolyte, and external source of current is used for electrodeposition. In contrast, electroless deposition uses only one electrode and no external source of electric current.
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However, the solution for electroless deposition needs to contain a reducing agent so that the electrode reaction has the form:. In principle any hydrogen -based reducing agent can be used although the redox potential of the reducing half-cell must be high enough to overcome the energy barriers inherent in liquid chemistry. A major benefit of this approach over electroplating is that the power sources and plating baths are not needed, reducing the cost of production.
Electroplating - Wikipedia
This technique can also plate diverse shapes and types of surface. The downside is that plating is usually slower and cannot create thick plates of metal. As a consequence of these characteristics, electroless deposition is quite common in the decorative arts. Cleanliness is essential to successful electroplating, since molecular layers of oil can prevent adhesion of the coating.
ASTM B is a standard guide for cleaning metals prior to electroplating. Cleaning includes solvent cleaning, hot alkaline detergent cleaning, electrocleaning, and acid treatment etc. The most common industrial test for cleanliness is the waterbreak test, in which the surface is thoroughly rinsed and held vertical.
Electroplating
Hydrophobic contaminants such as oils cause the water to bead and break up, allowing the water to drain rapidly. Perfectly clean metal surfaces are hydrophilic and will retain an unbroken sheet of water that does not bead up or drain off. ASTM F22 describes a version of this test. This test does not detect hydrophilic contaminants, but electroplating can displace these easily since the solutions are water-based.
Surfactants such as soap reduce the sensitivity of the test and must be thoroughly rinsed off. Electroplating changes the chemical, physical, and mechanical properties of the workpiece. An example of a chemical change is when nickel plating improves corrosion resistance. An example of a physical change is a change in the outward appearance.
An example of a mechanical change is a change in tensile strength or surface hardness which is a required attribute in tooling industry. Copper-plated areas of mild steel act as a mask if case hardening of such areas are not desired. Tin-plated steel is chromium-plated to prevent dulling of the surface due to oxidation of tin. Electroplating, or electroless plating may be used as a way to render a metal part radioactive , by using an aqueous solution prepared from nickel— phosphorus concentrates which contain radioactive hypophosphite 32 P ions. Modern electrochemistry was invented by Italian chemist Luigi Valentino Brugnatelli in